Tianshan Technology Unveils First Dynamic Haptic Perception Chip and Solutions
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At the 2026 World Artificial Intelligence Conference, Tianshan Technology showcased its groundbreaking dynamic haptic perception chip, the Green Gem E10A, along with the TS-ECHO haptic sensing glove and the TS-V visual-tactile fusion light module testing workstation. This marks a shift in focus from robotic movement capabilities to enhancing robots' tactile precision and stability.
The significance of these innovations lies in the growing necessity for robots to possess tactile perception, which is becoming a critical industrial metric. The Green Gem E10A chip offers low-latency, low-power signal processing, enabling large-scale sensor deployment. The TS-ECHO glove establishes standards for haptic data collection, while the testing workstation validates technical solutions in real-world scenarios, creating a feedback loop for continuous system improvement.
Looking ahead, the integration of extensive sensor networks across humanoid robots is essential for full-body tactile coverage. The Green Gem E10A chip's innovative design reduces latency and power consumption, enhancing safety and performance. As the industry moves towards a more tactile-aware robotic future, the ability to understand physical interactions through haptic data will be crucial for advancing robotic capabilities.
Original report
First Dynamic Haptic Perception Chip and Solutions by Tianshan Technology
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