China's Etching Equipment Localization Rate Reaches 41%, High-End Replacement Just Beginning
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China's localization rate for etching equipment has reached 41% by Q2 2026, with expectations of 45% for the year. This indicates that domestic manufacturers have secured most new orders in mature processes, but high-end replacements in advanced logic and 3D NAND are just starting. The U.S. MATCH Act links localization rates to regulatory conditions, marking a significant shift in export controls.
The etching process is crucial in chip manufacturing, ranking second only to lithography in front-end equipment. The market for etching equipment in China is projected to grow to approximately 160 billion yuan in Q2 2026, driven primarily by demand from storage technologies like 3D NAND and DRAM. The growth in the number of stacked layers in 3D NAND is increasing the need for etching steps, thus boosting equipment usage.
The MATCH Act, proposed in April 2026, aims to tighten export controls by linking them to company-level regulations rather than factory-level. This change means that companies like Changxin Storage and Yangtze Memory Technologies will require licenses for advanced equipment purchases across all their factories. The future of domestic high-end etching equipment depends on the verification progress of new models and the impact of the 75% localization threshold on U.S. export regulations.
Original report
刻蚀设备国产化率升至41%，高端替代才刚起步
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