Events

AIS 2027: AI Sensors and Transducers, Kunming

AIS 2027, the 4th International Conference on AI Sensors and Transducers by MDPI, runs Jul 29–Aug 3, 2027 in Kunming, China. Venue and fees TBA.

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AIS 2027: AI Sensors and Transducers, Kunming
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AIS 2027 | AI Sensors and Transducers Conference Moves to Kunming

The 4th International Conference on AI Sensors and Transducers, organized by MDPI, runs July 29–August 3, 2027 in Kunming, Yunnan, China, covering intelligent sensing for wearable electronics, biomedical monitoring, robotics, the Internet of Things, and industrial intelligence..

QUICK FACTS

DateJul 29–Aug 3, 2027
LocationKunming, Yunnan, China
Venue—
OrganizerMDPI (via its Sciforum conference platform); conference chairs Eric M. Yeatman (University of Glasgow), Alexander Star (University of Pittsburgh), Wen Jung Li (City University of Hong Kong) and Chengkuo Lee (National University of Singapore)
Event typeAcademic Conference
Official websitehttps://sciforum.net/event/AIS2027
Registrationhttps://sciforum.net/event/AIS2027/registration
Admission

Academic: €500 early bird (until 7 Jun 2027) / €600 regular (8 Jun–2 Aug 2027)

Keynote/invited speaker: €450 early bird / €550 regular

Student: €300 early bird / €350 regular

Non-academic: €700 early bird / €800 regular

In-person event.

ScaleThe first three editions (Singapore 2024, Kuala Lumpur 2025, Jeju 2026) drew nearly 1,350 participants from over 40 countries in total. The 2026 Jeju edition drew nearly 600 participants from 30 countries, with 60 plenary and keynote speakers and 27 symposia.
Key deadlines

Abstract submission deadline: 26 Mar 2027

Early bird registration deadline: 7 Jun 2027

Regular registration deadline: 2 Aug 2027

EVENT OVERVIEW

The 4th International Conference on AI Sensors and Transducers (AIS 2027) will take place July 29 to August 3, 2027 in Kunming, the capital of China's Yunnan province. The in-person meeting is organized by the open-access publisher MDPI through its Sciforum platform, with conference chairs from the University of Glasgow, the University of Pittsburgh, City University of Hong Kong and the National University of Singapore. Abstracts are due 26 March 2027, and early-bird registration closes on 7 June 2027.

AIS focuses on the combination of artificial intelligence with sensor and transducer technologies, including tactile and soft sensors for robotics, wearable electronics, biomedical monitoring, IoT and industrial sensing. The series began in Singapore in 2024, moved to Kuala Lumpur in 2025 and to Jeju, South Korea, in 2026; together the three editions drew nearly 1,350 participants from more than 40 countries. The 2026 meeting, the largest so far, drew nearly 600 participants from 30 countries, with 60 plenary and keynote speakers across 27 symposia. For 2027, Zhonglin Wang of the Beijing Institute of Nanoenergy and Nanosystems is listed as plenary speaker. MDPI journals including Sensors, Micromachines and Robotics act as publishing partners.

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KEY HIGHLIGHTS

  • Plenary speaker Zhonglin Wang (Beijing Institute of Nanoenergy and Nanosystems): among the roughly 230,000 scientists across all fields in the world's top 2% list compiled by Elsevier and Stanford, he ranks #1 for both career-long and single-year scientific impact in every year from 2019 to 2024, and #1 in materials science and in nanotechnology. His research has more than 550,000 citations on Google Scholar, with an h-index of 353.

  • Intelligent sensing for robotics, wearable electronics, biomedical monitoring, IoT and industrial applications

  • Publishing partnerships with more than a dozen MDPI journals, including Sensors and Robotics

  • Best oral, poster and student presentation awards (2026 edition)

RECOMMENDED ATTENDEES

Academic researchers working on flexible, tactile and soft sensors, MEMS and transducers; robotics R&D teams focusing on robot skin, tactile perception and embodied intelligence; designers and developers of wearable systems and biomedical monitoring devices; R&D engineers from sensor, semiconductor and automation enterprises worldwide; industrial robot and intelligent equipment developers; as well as graduate students looking for an integrated conference platform with supported journal publication pathways.

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