Manufacturers Must Rethink Data Center Power and Thermal Management Amid AI Infrastructure Growth
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- AutomationWorld.com
Data center rack density has surged to an average of 27 kW, significantly impacting development planning as operators rush to deploy AI-capable infrastructure. This rapid growth highlights a critical bottleneck in the physical infrastructure necessary for effective power and thermal management, which has not received adequate attention compared to chips and software. Manufacturers are now required to innovate their designs to accommodate increasing power demands without expanding physical footprints.
The shift towards higher rack densities necessitates a systems-level approach to power delivery, cooling, and controls, as these components are interdependent. Traditional methods of engineering these systems separately are no longer viable, as decisions in one area can constrain the others, leading to deployment delays. Manufacturers who integrate these systems into a cohesive architecture are better positioned to meet the demands of AI-capable infrastructure, ensuring they can fulfill customer promises regarding production capabilities and timelines.
Capgemini Americas' Shashank Mane emphasizes the importance of treating physical infrastructure with the same level of scrutiny as computing resources. As AI infrastructure continues to expand, manufacturers must prioritize capacity planning that includes power, cooling, and controls to avoid limits that could hinder future growth and deployment efficiency. No further timeline was disclosed at the time of publication.
Original report
AI Infrastructure Expansion Pushes Manufacturers To Rethink Data Center Power And Thermal Management
AutomationWorld.com · Shashank ManeThis briefing is an independently written summary based on publicly available reporting and is provided for industry information and news discovery. The original report and source publication are credited and linked where applicable. RobotToday does not claim ownership of third-party source material.
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