NVIDIA and Cisco Unveil USFP Optical Module to Enhance AI Factory Connectivity
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- NvidiaNews
NVIDIA and Cisco have announced the Ultra-Dense Small Form Factor Pluggable (USFP), a new optical module designed for 400Gb/s-per-lane connectivity in AI factories. This innovation addresses the increasing demand for bandwidth and connections as AI models evolve, allowing operators to maximize their infrastructure investments while managing network complexity and costs.
The USFP module is crucial for scaling AI factories, enabling connections of up to 1.6Tb/s endpoints without adding network tiers. By doubling the lane count and bandwidth per lane, it offers significant improvements in overall capacity and power efficiency compared to existing modules. This advancement is expected to facilitate the growth of AI workloads without necessitating a complete overhaul of data center infrastructure.
Looking ahead, the collaboration between NVIDIA, Cisco, and partners like TE Connectivity and Amphenol aims to establish a robust ecosystem for high-density pluggable infrastructure. The first USFP-based transceivers are set to support 12.8Tb/s overall capacity, with future expansions planned. No further timeline was disclosed at the time of publication.
Original report
NVIDIA and Cisco Introduce New Pluggable Optics Form Factor to Scale AI Factories
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