Search Global Robotic and AI Suppliers
A continuously updated global directory of robotics, automation, and AI suppliers
Supplier directory
NXP Semiconductors 恩智浦半导体
Netherlands
Dutch semiconductor maker supplying automotive and edge processors, microcontrollers and sensors that power robotics platforms.
NavInfo Co. Ltd. 北京四维图新科技股份有限公司
China
China's leading HD map and navigation data provider for autonomous vehicles, offering SD/HD/ADAS maps and IVI chipsets; rebranded SeeWay.ai in 2025.
Black Sesame Technologies Co., Ltd. 黑芝麻智能科技有限公司
China
AI automotive chip company developing Huashan-series SoCs for autonomous driving and advanced driver assistance systems.
DeepRoute.ai 元戎启行
China
Chinese full-stack autonomous driving company building a VLA-model AI driver for mass-production smart driving on NVIDIA DRIVE platforms.
Horizon Robotics 地平线
China
Chinese developer of automotive AI compute chips and software for ADAS and autonomous driving.
Fortsense Co., Ltd. 深圳市灵明光子科技有限公司
China
Shenzhen IC design house that was first to mass-produce area-array SPAD LiDAR receiver chips for automotive, industrial, robotics and 3D sensing.
Infineon Technologies AG
Germany
German semiconductor maker producing MCUs, power management ICs, automotive sensors, memory, and wireless chips for automotive, industrial, IoT, and defence.
onsemi
United States
US semiconductor supplier of intelligent power and sensing devices, including SiC, image sensors and ADAS-grade chips for automotive and industrial systems.
Magntek 上海麦歌恩微电子股份有限公司
China
Shanghai-based magnetic sensor IC maker founded 2009, serving robot joints, AGV motors, and automotive applications with ISO 26262 ASIL-D certified chips.
BOS Semiconductors
Korea, Republic of (South)
Korean fabless semiconductor startup designing AI SoC chips for autonomous driving and robotics, including the Eagle-N 250 TOPS chiplet.
Swift Navigation
United States
US provider of centimeter-accurate GNSS positioning solutions: RTK receivers, Starling engine, and Skylark cloud corrections for autonomous vehicles.
Suzhou TendonBot Tech. Co., Ltd. 苏州智行腱机器人科技有限公司
China
Kunshan startup building bio-inspired artificial tendon actuators, dexterous hands, and data gloves for embodied-intelligence robots.
Hubei Kait Automotive Electronic & Electrical Systems Co., Ltd. 湖北开特汽车电子电器系统股份有限公司
China
BSE-listed Wuhan auto-electronics maker expanding into vehicle-grade force sensors, encoders and integrated joints for robots.
Nations Technologies (Guomin Technology) 国民技术
China
Shenzhen-listed chipmaker (300077.SZ) founded in 2000 that launched its N32H MCU series for humanoid robot controllers in July 2026.
Suxian Micro 速显微
China
Suxian Micro is a Tianjin-based fabless chipmaker known for its Tiandu-series display GPUs and an August 2026 TH1100 GPGPU aimed at embodied-AI robotics.
XPENG Inc. 小鹏汽车
China
Chinese EV maker expanding into autonomous vehicles and humanoid robotics; developing IRON humanoid robot targeting mass production in 2026.
Aeva
United States
Aeva builds 4D LiDAR sensors using unique FMCW technology that detects velocity and range simultaneously on a silicon-photonics chip.
SK hynix Inc. SK海力士
Korea, Republic of (South)
South Korean memory giant (KRX: 000660) and world's primary HBM3E supplier powering NVIDIA H100/H200 and other AI accelerators for robotics and AI compute.
Rockchip Electronics Co., Ltd. 瑞芯微电子股份有限公司
China
Chinese fabless semiconductor company designing ARM-based SoCs for AI vision, tablets, IoT, automotive, and industrial applications since 2001.
Arm Ltd
United Kingdom
British semiconductor IP company designing RISC CPU architectures licensed to chip makers worldwide, powering robots, IoT, automotive, and mobile devices.
LightIC Technologies USA, Inc.
United States
Silicon Valley startup (est. 2019) developing FMCW LiDAR chips and systems on silicon photonics for automotive, industrial, and robotics markets.
Lisleapex Electronics
Taiwan
Taiwan distributor of electronic components including semiconductors, ICs, and memory chips, serving global industrial and automotive markets since 2004.
Maxim Integrated 美信集成产品
United States
Analog and mixed-signal IC designer acquired by Analog Devices in 2021, supplying sensor, power management, and interface chips for robotics and industry.
SiMa Technologies Inc.
United States
US edge AI chip firm founded 2018 that designs the Modalix MLSoC platform for physical AI in robotics, industrial, and automotive applications.
indie Semiconductor
United States
Automotive mixed-signal SoCs and software for ADAS, LiDAR, radar, ultrasonic, electrification, and humanoid robotics sensing.
Hangzhou Silan Microelectronics Co., Ltd. 杭州士兰微电子股份有限公司
China
Hangzhou Silan Microelectronics (SSE: 600460) is a Chinese IDM making IGBTs, intelligent power modules, MCUs and MEMS sensors for power and motor control.
Huixi Technology (Beijing) Co., Ltd. 北京辉羲智能信息技术有限公司
China
Beijing chip startup building compute platforms for embodied-intelligence robotics, rooted in autonomous-driving perception silicon.
Solid-VUE 솔리드뵐
Korea, Republic of (South)
South Korean fabless semiconductor company developing solid-state LiDAR sensor SoCs for autonomous vehicles, robotics, and drones.
Terafab
United States
Tesla/SpaceX/xAI semiconductor fab announced March 2026 in Austin TX; produces AI chips for Optimus robots, FSD, and SpaceX satellites.
XINMING 合肥芯明智能科技有限公司
China
Hefei chip designer founded 2020; NU4000/NU4100 are the only mass-produced single-chip SoCs integrating 3D stereo vision, AI, and SLAM for robotics.
