inFollow
inFollow
Shinkawa Ltd.

Shinkawa Ltd.

Manufacturer

Japanese pioneer of semiconductor wire bonding automation; founded 1959; now part of Yamaha Robotics group via 2019 merger.

Visit Website

Company Overview

Shinkawa Ltd., founded in 1959, pioneered semiconductor wire bonding automation in Japan. The company developed the world's first fully-automatic wire bonder in 1977. In 2019, Shinkawa's semiconductor bonding business was integrated into Yamaha Motor Robotics Holdings, with the Shinkawa brand continuing under Yamaha Robotics.

Shinkawa Technologies now provides aftermarket services, spare parts, and refurbishment for wire bonders, die bonders, and flip chip bonders.

Capabilities & Activities

Primary type & automation activities this supplier delivers:

Applications & Industries

Product Categories

Products & Solutions

Wire Bonder

Semiconductor wire bonding equipment for chip interconnection.

Die Bonder

Semiconductor die bonding equipment for chip attachment.

Flip Chip Bonder

Semiconductor flip chip bonding equipment for advanced packaging.

Partnership & Notable clients

Associating Events

Listed in RobotToday Supplier Discovery. Verified Profile

More related news

  1. 1
  2. 2
  3. 3
  4. 4
  5. 5
  6. 6
  7. 7
  8. 8
  9. 9
  10. 10
  11. 11
  12. 12
  13. 13
  14. 14
  15. 15
  16. 16
  17. 17
  18. 18
  19. 19
  20. 20

Contact Shinkawa Ltd.

WEBSITE

https://www.shinkawa-tech.com

PHONE

+81 42-545-5111

HEADQUARTERS

3-2-25 Musashino
Musashimurayama , Tokyo  208-0011

Japan

Company Facts

Founded

1959

Primary Role

Manufacturer

Company Size

employees 100-500

Primary Region

Asia-Pacific

Annual Sales

-

Funding Stage

Subsidiary / Acquired

Funding Total

-

Export Markets

Keywords

© Copyright 2026 RobotToday. All rights reserved powered by RobotToday.com