ChipMing Launches Advanced 3D Vision AI Modules at WAIC 2026 in Shanghai
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- leaderobot.com
On July 17, 2026, the World Artificial Intelligence Conference (WAIC) commenced in Shanghai, where ChipMing unveiled its series of 3D vision AI modules designed for embodied intelligence and physical AI scenarios. The modules demonstrated core functionalities such as pose estimation and instance segmentation using the self-developed spatial intelligent chip running YOLO26, alongside a 3D virtual safety zone application that integrates depth perception and AI recognition technologies.
The significance of these modules lies in their ability to operate reliably in industrial environments, with a temperature range of -10℃ to 50℃. They support USB 3.0 and GMSL 2.0 protocols, ensuring high bandwidth and long-distance transmission capabilities. The built-in spatial intelligent chip allows for local processing of data, enhancing privacy and reliability by keeping sensitive information on-device, which is crucial for applications in security, healthcare, and industrial quality inspection.
Looking ahead, the 3D virtual safety zone demo showcased at WAIC attracted considerable attention, highlighting the modules' capabilities in object classification and selective alarm systems. Users can choose from various module models based on specific use cases, ensuring ease of installation and strong feasibility for engineering applications. No further timeline was disclosed at the time of publication.
Original report
ChipMing Unveils 3D Vision AI Modules at WAIC 2026
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