Infotech Automation Inc.
"Precision in Motion"
US subsidiary of Swiss Infotech AG, supplying die bonding, dispensing, and power module systems for semiconductor and microelectronics manufacturers.
Infotech Automation Inc. is the United States subsidiary of Infotech AG, a Swiss precision automation company founded in 1984 in Grenchen, Switzerland. The US entity was established in 2023 in Watertown, Connecticut. Infotech designs and manufactures high-accuracy automated production systems for die bonding, dispensing, sorting, packaging, testing, and power module production.
Products include die bonders for semiconductor assembly, 2D/3D dispensing cells, and power module equipment including sinter bonders, ultrasonic welders, preform assemblers, and KGD testers. The modular Infotech Component Matrix offers over 1,000 peripheral options for customer-specific configurations. Systems are manufactured in Switzerland under ISO 9001 and ISO 14001 certifications.
Markets served include electronics, semiconductor, watch, micromechanics, biotech, medical device, and automotive.
Primary type & automation activities this supplier delivers:
Dispensing Cell
High-precision 2D/3D dispensing system for automated microelectronics production, configurable via the Infotech Component Matrix for semiconductor assembly and bonding applications.
Sinter Bonder
Pressure-assisted sintering system for power electronics module assembly, enabling precise chip-to-substrate connections for automotive and industrial power module manufacturing.
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Contact Infotech Automation Inc.
WEBSITE
https://www.infotech-automation.com/PHONE
+1 860 631 3905HEADQUARTERS
United States
Company Facts
Founded
2023
Primary Role
Manufacturer
Company Size
-
Primary Region
North America
Annual Sales
-
Funding Stage
-
Funding Total
-
