ASM Pacific Technology (Hong Kong)
ASMPT, formerly ASM Pacific Technology, founded 1975; supplies die and wire bonding, SMT placement, and packaging gear, listed on HKEX as 0522.
"ASMPT Limited, previously known as ASM Pacific Technology, is a semiconductor and electronics manufacturing equipment supplier founded in 1975. The company is listed on the Stock Exchange of Hong Kong under stock code 0522, with its headquarters registered in Singapore and long-standing operations based in Tsing Yi, Hong Kong. Bassel Haddad became Group Chief Executive Officer in August 2026.
The Semiconductor Solutions segment supplies thermo-compression bonding tools for chip-to-substrate and chip-to-wafer assembly, multi-chip and hybrid wire bonding equipment developed with EV Group, and the ALSI LASER1206 laser dicing system, extending into co-packaged optics and other heterogeneous integration processes. The SMT Solutions segment covers the SIPLACE V placement platform and the DEK TQ XL screen printer for surface-mount assembly. Through its Critical Manufacturing subsidiary, ASMPT also sells a manufacturing execution system alongside an IoT data platform, Material Management 4.0, and data-driven quality analytics software, supporting semiconductor packaging and printed circuit board assembly lines.
ASMPT counts IBM, Texas Instruments, Intel, and Kokusai Electric among its customers and collaborators, and has received the HKMA Quality Award Grand Award, a Texas Instruments Supplier Excellence Award, and an Intel EPIC Supplier Award."
Primary type & automation activities this supplier delivers:
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Contact ASM Pacific Technology (Hong Kong)
WEBSITE
https://www.asmpt.comHEADQUARTERS
Hong Kong
Company Facts
Founded
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Primary Role
Manufacturer
Company Size
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Primary Region
Asia-Pacific
Annual Sales
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Funding Stage
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Funding Total
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