DIC Corporation

MoR™ technology utilizes Molded Interconnect Device (MID) capabilities to integrate circuit patterns into molded forms, enabling them to function as sensors. It detects various signals such as weight, temperature, strain, and conductivity, allowing for responsive manipulation of objects. This innovation provides flexibility for diverse applications, enhancing functionality beyond traditional limitations. HAGAMOSphere® 2.0 features an omnidirectional multicopter design with a tiltrotor mechanism for optimal performance in extreme environments. Constructed from high-strength carbon fiber, it offers impact resistance and supports aerial and ground movement. This drone is ideal for high-load applications, including infrastructure inspection and disaster response. Tacthancer™ is a tactile sensitivity enhancement technology that amplifies the detection of surface flaws without requiring a power source. It can be integrated into wearable devices to enhance human tactile sensation and can also interface with sensors for data recording. This technology expands the possibilities for sensing applications across various fields.