ESPROS Photonics Corporation
Swiss fabless semiconductor company designing ToF imaging chips and 3D camera modules for robotics, industrial automation, and automotive sensing.
ESPROS Photonics Corporation is a Swiss fabless semiconductor company founded in 2006 by Beat De Coi, headquartered in Sargans, St. Gallen, Switzerland. The company develops high-performance time-of-flight (ToF) imaging chips, 3D camera modules, and custom ASIC solutions based on a proprietary CMOS/CCD hybrid process it owns and operates. Core products include the epc611 single-pixel ToF chip for proximity sensing, the epc635 and epc660 QVGA (320x240) fully integrated 3D ToF imagers, and the DME-series camera modules.
These components are used in industrial automation, robotics collision avoidance, autonomous vehicles, and human-machine interfaces. ESPROS serves OEM customers across Europe, Asia, and North America, with subsidiaries in China and the USA supporting global distribution. The company employs over 70 engineers at its Swiss headquarters.
Primary type & automation activities this supplier delivers:
epc660 3D ToF Imager
Fully integrated 320x240 pixel QVGA 3D time-of-flight imager chip for short- to mid-range distance measurement.
epc611 ToF Chip
Single-pixel CMOS ToF chip for proximity sensing and object detection in compact embedded applications.
More related news
- 1
- 2
- 3
- 4
- 5
- 6
- 7
- 8
- 9
- 10
- 11
- 12
- 13
- 14
- 15
- 16
- 17
- 18
- 19
Contact ESPROS Photonics Corporation
WEBSITE
https://www.espros.comHEADQUARTERS
Switzerland
Company Facts
Founded
2006
Primary Role
Component Supplier
Company Size
-
Primary Region
Europe
Annual Sales
-
Funding Stage
-
Funding Total
-
